Key electronic components

Description

Key electronic components Call: 2nd call for proposals for industrial reinforcement actions under the Programme Identifier: EDF-EDIP-P-2027-LS-IRA-KEC Call identifier: EDF-EDIP-P-2027-LS-IRA Kind: bando (topic) Status: aperto Opening date: 2026-06-17 Deadline: 2027-02-16 Deadline model: single-stage Type of action: EDF Lump Sum Grants Budget: 2027: 282150000 EUR Programme period: 2021 - 2027 Description Expected Impact: Projects are expected to deliver results aligned with the expected results set out in this call topic and to evidence their contribution through dedicated KPIs defined in the proposal. Expected results include: • tangible capacity increases in EU-based production of the targeted electronic components, with demonstrated contribution to competitiveness; • improved resilience & geographical distribution of supply, reducing single points of failure; • strengthened availability and security of supply for priority defence product production lines, commensurate with identified risks and exposure to the risk of • materialisation of conventional military threats; • and measurable lead-time reductions, establishment or availability of reserved capacity where applicable, and workforce trained to operate and sustain the reinforced production lines. Proposals shall define, baseline and track KPIs such as added throughput (units/month), time-to-rate, lead-time reduction, yield/quality improvements, qualified output delivered, reserved capacity parameters, and numbers of staff trained, alongside indicators evidencing risk mitigation (e.g., supply-chain robustness and obsolescence management outcomes). Where implemented, the physical and cyber protection W P is expected to deliver measurable improvements in site and production security, evidenced through threat assessment protected sites to support the security measures and KPIs (e.g., coverage of protected areas/assets, detection/alert performance, response readiness, critical vulnerabilities mitigated). Those KPIs shall be linked to the project’s overall risk register and show how risk exposure is reduced and how production continuity is improved, thereby limiting the likelihood and/or impact of incidents that could delay production ramp-up or affect output and delivery reliability (including, where relevant, the availability of reserved capacity and the achievement of workforce-related milestones). Objective: This topic aims to strengthen the competitiveness, responsiveness and ability of the EDTIB to reinforce EU industrial production capacity for key electronic components (including their components and corresponding raw materials insofar as they are intended or used wholly for the production of defence products) that constitute critical bottlenecks for key defence product, across land, air, naval and underwater domains: • (swarming) UxSs and loitering munitions (including FPV variants, interceptor drones, and AI-enabled/autonomy-enabled UxS integration lines); • (counter-)UxS systems (including EW-resilient defeat concepts and counter-interceptor solutions); • missile (defence) systems (including missile seekers / terminal sensing sub-systems); • precision-guided munition (PGM); • mobile communication nodes and C2 systems (including UxS datalinks/video transmission, relay/repeater nodes, underwater communication systems, cryptosystems and LTE/5G-enabled variants where relevant); • and C4ISR (Command, Control, Communications, Computers, Intelligence, Surveillance, and Reconnaissance) including Electronic Warfare (EW, including secure tactical networking, trusted/anti-tamper enabled C4ISR/EW equipment), underwater ISR/ASW, sonar, radars, EO sensors, wideband multifunction RF systems and all associated processing. Actions shall be aligned with the objectives, scope and priorities of this call topic and shall contribute to the competitiveness of the EU defence technological and industrial base by securing specific production capacity for: • guidance electronics (including flight controller stacks, inertial measurement unit (IMUs), Galileo PRS receiver and sensor-fusion electronics); • propulsion electronics (including electronic speed controllers (ESCs), motor control units, power distribution boards (PDBs), battery management system (BMS) electronics and propulsion power-conditioning modules); • RF and laser modules (including RF front-end building blocks, T/R modules where applicable, datalink modules/chipsets and enabling RF/EO components like high-speed mixed-signal components and precision timing and frequency reference components, laser driver/control electronics, and laser transmit/receive sub-modules); • multispectral cameras (including thermal/EO sensing modules, relevant dependencies like video transmission modules where applicable and low observable underwater sensors); • avionics (including EW systems, edge compute integration where relevant to autonomy-enabled variants); • PCBs and IC substrates (including HDI/secure PCBs, high-frequency la

Sectors

Source

Source: ec.europa.eu