PICs@ICFO Strategic Initiative: Postdoctoral Researcher in TGV Metallization and Seed-Layer Processes

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Offer Description: As part of the PICs@ICFO Strategic Initiative , ICFO coordinates PIXEurope, a flagship Pilot Line funded under the European Chips JU program , focused on Advanced Photonic Integrated Circuits (PICs) through which ICFO is advancing frontier technologies, including optical interposers for Co-packaged optics for next-generation optoelectronic and photonic devices. To strengthen this initiative, ICFO is seeking a highly motivated Engineer/Scientist with strong expertise in thin-film deposition and metallization of high-aspect-ratio Through-Glass Vias (TGVs). Position Overview: , We offer a post-doctoral position to a scientist with hands-on experience in thin-film deposition, surface preparation, and metallization for semiconductor, MEMS, or advanced-packaging applications. The successful candidate will develop, optimize, and scale reliable adhesion, barrier, and conductive seed layers inside high-aspect-ratio glass vias, ensuring continuity and compatibility with subsequent copper plating and interconnection processes. Key Responsibilities: , The selected candidate will be expected to: Develop and optimize seed-layer deposition processes for high-aspect-ratio Through-Glass Vias Develop substrate cleaning, glass-surface activation, and adhesion-promotion processes Develop adhesion, barrier, and conductive seed stacks such as Ti/Cu, Cr/Cu, TiW/Cu, and related systems Optimize sputtering, evaporation, electroless, ALD or CVD-assisted, and hybrid deposition approaches Achieve continuous and conformal seed coverage along via entrances, sidewalls, and exits Characterize thickness, morphology, resistivity, adhesion, continuity, and wafer-level uniformity Identify and mitigate shadowing, seed discontinuity, oxidation, delamination, and cracking Coordinate with the laser and glass team to align via geometry and surface condition with seeding, plating, and interconnection requirements This position will report to the Prof. Dr. Valerio Pruneri, Director of the European Chips JU Pilot Line PIXEurope. PIXEurope is co-funded by the Chips Joint Undertaking and national funding authorities of the Participating States, Spain, Ireland, The Netherlands, Finland, Belgium, Portugal, Poland, Austria, France, Italy, United Kingdom. In particular, it is co-funded by Spain through the Ministry for Digital Transformation and Civil Service under reference CJU-010000-2025-0005, as part of the Recovery, Transformation and Resilience Plan (PRTR). Requirements: Research Field Chemistry » Other Education Level PhD or equivalent Research Field Physics » Other Education Level PhD or equivalent Research Field Engineering » Electrical engineering Education Level PhD or equivalent Research Field Engineering » Chemical engineering Education Level PhD or equivalent Skills/Qualifications Applicants must hold a PhD in materials science, chemistry, chemical engineering, electrical engineering, microelectronics, physics, microengineering, or related fields, or equivalent research experience. Candidates should demonstrate expertise in the following areas (not all mandatory, but strongly preferred): Thin-film deposition by sputtering, evaporation, ALD, CVD, or electroless methods Metallization processes for semiconductor, MEMS, microfabrication, or advanced-packaging applications Surface preparation, activation, and surface chemistry of glass or dielectric materials Metal-to-dielectric adhesion and adhesion/barrier/seed-layer material systems Metallization or coating of high-aspect-ratio three-dimensional structures Redistribution layer patterning and fabrication Electrical and structural characterization of thin films and interconnects Cleanroom processes, safety procedures, and fabrication protocols Process optimization, reproducibility, failure analysis, and wafer-level uniformity Desired (but not required): Direct experience with Through-Glass Via or Through-Silicon Via metallization Experience with FIB/SEM cross-sections, X-ray inspection, four-poin Bando dell'ente: Contents Job openings Team Leaders Group Opening Cap de Labor Affairs Head of Legal Affairs Post-doctoral Researchers Group Opening Nanophotonics Theory Group: Post-doctoral position in design of integrated photonic waveguides with optimum in/out-coupling to light Neurophotonics and Mechanical Systems Biology Group: Post-doctoral position in advanced optical trapping within cells and biomolecular condensates Medical Optics Group: Post-doctoral position in speckle contrast optical spectroscopy (SCOS) for non-invasive blood flow measurement Quantum NanoElectronics and NanoMechanics Group: Post-doctoral position in nanotube electromechanics CO2 Mitigation Accelerated by Photons Group: Post-doctoral positions in advanced water electrolysis and scale-up Quantum NanoElectronics and NanoMechanics Group: Post-doctoral positions in analogue electron quantum simulator Quantum Photonics with Solids and Atoms Group: Post-doctoral position in quantum repeaters with solid-state quantum nodes Optoelectronics Group: Post-doctoral in application-driven PIC development for neutral atom quantum technologies Atomic Quantum Optics Group: Post-doctoral positions in Experimental quantum sensing with atomic systems Ultracold Quantum Gases Group: Post-doctoral position on quantum-gas microscopy of SU(N) Fermi-Hubbard models CO2 Mitigation Accelerated by Photons Group: Post-doctoral position in automation of electrolysis systems Quantum Photonics with Solids and Atoms Group: Post-doctoral position in Development of Cold Atom-Based Quantum Network Nodes PICs@ICFO Strategic Initiative: Postdoctoral Researcher in TGV Metallization and Seed-Layer Processes Medical Optics Group: Post-doctoral position in applications of near-infrared spectroscopy and diffuse correlation spectroscopy in critical care Project Engineers Group Opening PICs@ICFO Strategic Initiative: Junior Research Engineer position in PIC Design and Simulation PICs@ICFO Strategic Initiative: Junior Process Enginee

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Fuente: euraxess.ec.europa.eu